• 姓名: 杨妍
  • 性别: 女
  • 职称: 研究员
  • 职务: 
  • 学历: 博士
  • 电话: 010-82995876
  • 传真: 
  • 电子邮件: yyang10@ime.ac.cn
  • 通讯地址: 北京市朝阳区北土城西路3号
  • 邮政编码: 100029
  • 所属部门: 先导中心光子器件与集成技术部
    简  历:
  • 教育背景:

    2011年 - 2015年,新加坡南洋理工大学 / 新加坡IME A*Star,博士,微电子学 / 光子学

    工作简历:

    2021年3月至今,中科院微电子所,集成电路先导工艺研发中心,研究员

    2018年7月-2021年3月,中科院微电子所,集成电路先导工艺研发中心,副研究员

    2017年 - 2018年,新加坡南洋理工大学,Research Fellow 

    2016年 - 2017年,美国Inphi公司,Staff R&D Engineer 

    2015年 - 2016年,美国Inphi公司,Senior R&D Engineer

    社会任职:
  •  
    研究方向:
  • 硅基光电子器件与集成,2.5D/3D硅基光电子集成
    承担科研项目情况:
  • 1. 国家自然科学基金,青年基金, 27.6万元,主持

    2. xx预研项目,480万元,主持

    3. 中科院人才项目,280万元,主持

    4. 中科院所长基金,50万元,主持

    5. xx领域基金,100万元,子课题负责人

    6. xx预研项目,53.4万元,子课题负责人

    代表论著:
  • Selected SCI Journal papers:                                                                  

    [1] Xiangpeng Ou, Yan Yang*, Bo Tang, Fujun Sun, Peng Zhang, Bin Li, Kai Huang, Ruonan Liu, Ling Xie, and Zhihua Li, “Thermo-optically Tunable Slot Waveguide-based Dual Mode-splitting Resonators with Enhanced Sharp Lineshapes,” Apr. 2022.

    [2] Tianxiang Dai, Yutian Ao, Jueming Bao, Jun Mao, Yulin Chi, Zhaorong Fu, Yiling You, Xiaojiong Chen, Chonghao Zhai, Bo Tang, Yan Yang*, Zhihua Li, Luqi Yuan, Fei Gao, Xiao Lin, Mark G. Thompson, Jeremy L. O’Brien, Yan Li, Xiaoyong Hu*, Qihuang Gong*, and Jianwei Wang*, “Topologically Protected Quantum Entanglement Emitters,” Nature Photonics, 16, 248-257 (2022). 封面文章.

    [3] Yulin Chi, Jieshan Huang, Zhanchuan Zhang, Jun Mao, Zinan Zhou, Xiaojiong Chen, Chonghao Zhai, Jueming Bao, Tianxiang Dai, Huihong Yuan, Ming Zhang, Daoxin Dai, Bo Tang, Yan Yang, Zhihua Li, Yunhong Ding, Leif K. Oxenl?we, Mark G. Thompson, Jeremy L. O’Brien, Yan Li, Qihuang Gong, and Jianwei Wang*, “A Programmable qudit-based quantum processor,” Nature Communications, 13: 1166 (2022) 

    [4] Jin Tao, Quan You, Zile Li, Ming Luo, Zichen Liu, Ying Qiu, Yan Yang, Yongquan Zeng, Zhixue He, Xi Xiao, Guoxing Zheng, and Shaohua Yu, “Mass-Manufactured Beam-steering Metasurfaces for High-Speed Full-Duplex Optical Wireless-broadcasting Communcations,” Advanced Materials, v. 34, n. 6, 2022.

    [5] Xiangpeng Ou, Yan Yang*, Fujun Sun, Peng Zhang, Bo Tang, Bin Li, Ruonan Liu, Daoqun Liu, and Zhihua Li, “Wide-range, ultra-compact, and high-sensitivity ring resonator biochemical sensor with CMOS-compatible hybrid plasmonic waveguide,” Optics Express, v. 29, n. 12, 2021.

    [6] Xiangpeng Ou, Yan Yang*, Bo Tang, Donghao Li, Fujun Sun, Peng Zhang, Ruonan Liu, Bin Li, and Zhihua Li, “Low-loss silicon nitride strip-slot mode converter based on MMI,” Optics Express, v. 29, n. 12, 2021.

    [7] Xiaojiong Chen, Yaohao Deng, Shuheng Liu, Tanumoy Pramanik, Jun Mao, Jueming Bao,

    Chonghao Zhai, Tianxiang Dai, Huihong Yuan, Jiajie Guo, Shao-Ming Fei, Marcus Huber, Bo Tang, Yan Yang*, Zhihua Li, Qiongyi He*, Qihuang Gong* & Jianwei Wang*, “A generalized multipath delayed-choice experiment on a large-scale quantum nanophotonic chip,” Nature Communications, (2021) 12:2712 焦点文章

    [8] Jin Tao, Lin Wu, Yan Yang, Zicheng Liu, Ying Qiu, Guoxing Zheng , and Shaohua Yu, “Light Spin Angular Momentum Spatial Mode Converter Based on Dielectric Metasurface,” Journal of Lightwave Technology, v. 39, n.8, 2021.

    [9] Xiaojun Bi, Jian Li, Zhen Gu, Bo Tang, Chaodi Sheng, Yan Yang*, and Qinfen Xu*, “High Sensitivity and Dynamic-Range 25 Gbaud Silicon Receiver Chipset With Current-Controlled DC Adjustment Path and Cube-Shape Ge-on-Si PD,” IEEE TCAS-I, v.67, n.11, 2020.

    [10] Liangui Deng, Juan Deng, Zhiqiang Guan, Jin Tao, Yang Chen, Yan Yang, Daxiao Zhang, Jibo Tang, Zhongyang Li, Zile Li*, Shaohua Yu*, Guoxing Zheng*, Hongxing Xu*, Cheng-Wei Qiu, and Shuang Zhang, “Malus-metasurface-assisted polarization Multiplexing,” Light: Science & Applications (2020) 9:101.

    [11] Juan Deng*, Yan Yang*, Jin Tao, Liangui Deng, Daoqun Liu, Zhiqiang Guan, Gongfa Li, Zile Li*, Shaohua Yu*, Guoxing Zheng*, Zhongyang Li, and Shuang Zhang, “Spatial frequency multiplexed meta-holography and meta-nanoprinting,” ACS NANO, v.13, 2019. (*co first author)

    [12] Lin Wu, Yan Yang, Zichen Liu, Jin Tao*, “Polarization controlled couplings of surface plasmon with asymmetrical nanoslit pairs,” Current Applied Physics, v.19, n.8, 2019.

    [13] Yan Yang*, Xiaonan Hu, Junfeng Song, Qing Fang, Mingbin Yu, Xiaoguang Tu, Guo-Qiang Lo, and Rusli, “Thermo-optically tunable silicon AWG with above 600 GHz channel tunability," IEEE Photonics Technology Letters, vol. 27, no. 22, pp. 2351-2354, 2015. 

    [14] Yan Yang*, Qing Fang, Mingbin Yu, Xiaoguang Tu, Rusli, and Guo-Qiang Lo, “High efficiency Si optical modulator using Cu travelling-wave electrode”, Optics Express, vol. 22, no. 24, pp. 29978-29985, Nov. 2014. 

    [15] Yan Yang*, Mingbin Yu, Rusli, Qing Fang, Junfeng Song, Liang Ding, and Guo-Qiang Lo, “Through-Si-via (TSV) keep-out-zone (KOZ) in SOI photonics interposer: a study of the impact of TSV-induced stress on Si ring resonators," IEEE Photonics Journal, vol. 5, no. 6, p. 2700611, Oct. 2013. 

    Selected International Conference papers and talk:

    [1] Yan Yang*, Mingbin Yu, Rusli, “RF modeling of the 3D electro-photonic integration based on SOI photonic TSV interposer,” IEEE EDSSC 2019, Invited Talk.

    [2] Yan Yang*, Mingbin Yu, Qing Fang, Junfeng Song, Xiaoguang Tu, Guo-Qiang Lo, and Rusli, “3D silicon photonics packaging based on TSV interposer for high density on-board optics module,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada, USA, 31 May – 3 June, 2016.

    [3] Mingbin Yu*, Yan Yang*, Qing Fang, Xiaoguang Tu, Junfeng Song, King-Jien Chui, Rusli, and Guo-Qiang Lo, “3D electro-optical integration based on high-performance Si photonics TSV interposer,” in Optical Fiber Communication Conference (OFC), Anaheim, California, USA, 20-24 March 2016.

    [4] Yan Yang*, Qing Fang, Mingbin Yu, Xiaoguang Tu, Junfeng Song, Rusli and Guoqiang Lo, “High-performance Si photonics interposer featuring RF travelling-wave electrode (TWE) via Cu-BEOL”, in Optical Fiber Communication Conference (OFC), paper Tu2A.6, Los Angeles, California, USA, 22-26 March 2015.

    获奖及荣誉:
  •  
    专利:
  • 第一发明人专利受理:

    2021:

    一种电光调制器,202110796025.7

    一种光电探测器,202110797165.6

    一种芯片,202110540846.4

    一种低功耗热光器件及其制作方法,202110224733.3

    一种光学器件测试结构及其制作方法,202110189580.3

    一种集成电路,202110181478.9

    一种波导结构的参数优化方法,202110161344.0

    一种光器件,202110050446.5

    2020:

    Method for manufacturing silicon optical interposer, method for manufacturing three-dimensional structure, method for integrating surface-electrode ion trap and silicon photoelectronic device, integrated structure, and three dimensional structure,SG 11202012334S

    Method for integrating surface-electrode ion and silicon photoelectronic device, integrated structure, and three dimensional structure,US 17/121,396

    一种光器件,2020112724156.6 

    一种光器件及其制造方法,202011467514.X

    一种电光器件及其制造方法,202011460458.7

    一种电光器件及其制造方法,202011460459.1

    一种热光器件及其制造方法,202011460354.6

    一种热光器件及其制造方法,202011460359.9

    一种半导体器件的制造方法及半导体器件,202011232024.1 

    一种铜互连线的制造方法及半导体器件,202011132578.4 

    一种光器件及其制作方法,202011432709.0 

    一种铜再布线层的制造方法、硅光器件及芯片,202011142132.X 

    2019:

    3D Integration architecture and process of silicon optical addressing and detection of ion qubit,PCT/CN2019/119912

    一种硅光转接板及三维架构的集成方法 201911120086.0 

    一种栅格形铜电极结构及其制备方法 201911149972.6

    表面电极离子阱与硅光寻址及探测器、及架构的集成方法 201911121046.8 

    一种表面电极离子阱与硅光器件的集成结构及三维架构 201911120744.6

    2018:

    Architecture Of Si Photonics/TSV Interposer And Ion Trapping For Scalable Quantum Computing, Singapore Patent No. 10201800666V