| 论文编号: | 172511O120120135 |
| 第一作者所在部门: | 九室一组 |
| 论文题目: | 采用加成法制备TGV玻璃转接板的研究 |
| 论文题目英文: | |
| 作者: | 孙瑜 |
| 论文出处: | |
| 刊物名称: | ICEPT-HDP2012 |
| 年: | 2012 |
| 卷: | |
| 期: | 1 |
| 页: | 1 |
| 联系作者: | 孙瑜 |
| 收录类别: | |
| 影响因子: | |
| 摘要: | Through Glass Via (TGV) is a new approch for Three-dimensional (3D) integration packaging. In this paper, a novel low cost process for manufacture TGV wafer was introduced. Different materials and process were compared. RF MEMS using TGV wafer was designed. |
| 英文摘要: | |
| 外单位作者单位: | |
| 备注: | EI收录 |
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