教育背景
2018.09-2022.09 北京理工大学 博士
工作简历
2025.12-至今 中国科学院微电子研究所 副研究员
2023.02-2025.12 中国科学院微电子研究所 助理研究员
先进封装；算力芯片封装基板；玻璃基板；功能基板；固化收缩及表征；电子电镀；表界面工程
作为项目负责人及技术骨干先后承担/参与自然基金、博士后、高技术、GJ等项目。
[1]面向高算力芯片的大规模基板异质界面黏附行为研究及应用，国家资助博士后研究人员计划，2023.02-2025.01，主持；
[2]面向高算力芯片封装基板的增层介质表面金属化粘附机理研究，北京市自然科学基金委员会，2025.01-2026.12，主持；
[3]算力芯片封装基板超精细线路界面粘附关键技术研究，微电子研究所，2024.01-2026.12，主持；
[4] xxx高密度基板技术，高新技术领域特区项目，2023.06-2024.10，技术负责人；
[5]面向万瓦级集成芯片的供电架构与电路关键技术研究，国家自然科学基金委员会，2024.01-2027.12，参与；
近五年第一作者/通讯作者发表SCI期刊论文12篇。
[1] S. J. Ding, M. Li, M. X. Liu, X. M. Wu, C. Chen, Q. C. An, Z. D. Fang, Q. D. Wang. Enhanced interfacial adhesion strength and reduced warpage of copper electrodeposited epoxy composite substrates by annealing treatment[J]. Surfaces and Interfaces, 2026, 84, 108573.
[2] S. J. Ding, J. Y. Zhao, X. M. Wu, P. Sun, F. Yang, M. Q. Gui, C. Chen, Z. D. Fang, Q. D. Wang. Review on warpage mechanisms and control of packaging substrates for large-scale chiplet integration[J]. Journal of Materials Science: Materials in Electronics, 2025, 36, 2149.
[3] S. J. Ding, J. Y. Zhao, C. Chen, X. M. Wu, Z. D. Fang, Q. D. Wang. Curing kinetics of a novel commercial epoxy-phenolic composite build-up film for flip-chip ball grid array (FCBGA) substrates[J]. Microelectronics Journal, 2025, 161, 106717.
[4] S. J. Ding, X. M. Wu, C. Chen, M. Q. Gui, P. Sun, F. Yang, X. Zhang, Z. D. Fang, Q. D. Wang. Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress[J]. Applied Surface Science, 2025, 684, 161911.
[5] S. J. Ding, X. M. Wu, X. Zhang, M. Q. Gui, Z. D. Fang, Q. D. Wang. Heterointerfacial adhesion failure mechanism of ultrahigh filler loading containing epoxy composite films for chip substrates[J]. RSC Applied Interfaces, 2024, 1, 1214-1221.
[6] S. J. Ding, Z. D. Fang, Z. Y. Yu, Q. D. Wang. Research Progress of Interfacial Adhesion Force of Copper Plating on Ajinomoto Build-up Films for Chip Substrates[J]. Materials Today Communications, 2023, 37,107201.
[7] S. J. Ding, Z. D. Fang, Z.Y. Yu, Q. D. Wang. Curing kinetics and mechanical properties of epoxy–cyanate ester composite films for microelectronic applications[J]. ACS Omega, 2023, 8(36): 32907-32916.
[8] S. J. Ding, G. C. Zhu, S. Zhao, L. Zhou, Y. J. Luo. Enhanced self-healing driving force in polymer materials by regulating molecular structure[J]. Materials Today Chemistry, 2023, 27, 101278.
[9] S. J. Ding, G. C. Zhu, S. Zhao, W. Wu, P. Jin, Y. K. Jiao, W. R. Zhai, L. Zhou, Y. J. Luo. Simultaneously optimized healing efficiency and mechanical strength in polymer composites reinforced by ultrahigh loading fillers based on interfacial energy and dynamic disulfide bonds[J]. Polymer, 2022, 251, 124711.
[10] S. J. Ding, Z. Wang, G. C. Zhu, X. M. Zhang, J. Zhang, Y. J. Zhang, Z. Q. Cen, L. Zhou, Y. J. Luo. Accelerating Self-Healing Driven by Surface Energy Using Bulky Ester Groups in Polymer Materials[J]. The Journal of Physical Chemistry C, 2021, 125(51): 28048-28058.
[11] S. J. Ding, J. Zhang, G. C. Zhu, X. Ren, L. Zhou, Y. J. Luo. Rationally constructed surface energy and dynamic hard domains balance mechanical strength and self-healing efficiency of energetic linear polymer materials[J]. Langmuir, 2021, 37(30): 8997-9008.
[12] S. J. Ding, J. Zhang, L. Zhou, Y. J. Luo. Promoting healing progress in polymer composites based on Diels-Alder reaction by constructing silver bridges[J]. Polymers for Advanced Technologies, 2021, 32(3): 1239-1250.
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