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论文

论文题目 作者 刊物名称 发表年度
Investigation of thermal characteristics and two-phase flows of a star-shape thin heat pipe ; Applied Thermal Engineering 2016
An electrical test method for quality detecting of wafer level eutectic bonding 张乐民; Journal of Micromechanics and Microengineering 2016
采用亚像素缝雕刻的图像整形算法 杨博; 计算机辅助设计与图形学学报 2016
长期日常血压监测及日常行为干预对高血压控制的影响 ; 心血管病防治知识 2016
Band40波段体声波滤波器的设计 韩茜茜; 微纳电子技术 2016
Simulation and fabrication of thin film bulk acoustic wave resonator 韩茜茜; Journal of Semiconductors 2016
A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology 欧毅; Applied Physics Letters 2016
基于PNN的网联汽车前方碰撞预警系统研究 ; 2016中国汽车工程学会年会论文集 2016
An All-Digital On-Chip Clock Generator Using Relative Reference Modeling 赵慧冬; The 2016 IEEE International Symposium on Radio-Frequency Integration Technology 2016
Layout Decomposition Algorithms for Double Patterning Lithography 张学连; ICSICT-2016 2016
体域网基带验证平台设计与实现 吴开斌; 电子技术应用 2016
Nanoforest of black silicon fabricated by AIC and RIE method ; Materials Letters 2016
SAPTL –based Robust Sub-threshold Adder Circuit Design 张琦; ICSICT-2016 2016
Turbocharging the channel ; Copyright Compound Semiconductor 2016
A Combined Wafer Bonding Method using Spin-coated Water Glass Adhesive Layer and Spot Pressing Bonding Technique 徐杨; IEEE 2016